How To Reflow Solder

1- put soldering paste on your board.

How to reflow solder. Kapton Film stencil to apply solder paste over PCB pads. Start the process by applying flux to the pads to make sure they are clean and will get heated properly. Solder balling occurs if the solder paste spatters small explosions during reflow or if the paste slumps and the flux spreads carrying away solder particles which cannot reflow back into the solder mass.

Heating may be accomplished by passing the assembly through a reflow oven under an infrared lamp or by. Reflow soldering is a process in which a solder paste is used to temporarily attach one or thousands of tiny electrical components to their contact pads after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state creating permanent solder joints.

The process of reflow soldering involves attaching components to metal pads on a circuit board with solder paste and then subjecting the entire unit to heat. Below in Figure 1 is an example of an Alpha OM-353 SAC 305 Lead Free profile graph. When uniform heat is applied to the components and circuit board the temporary connections can become permanent solder bonds.

New to soldering. A metal one can cost around 10 when you order your PCB and a milar one is even cheaper. Reflow soldering is a process in which solder paste is applied to the contact pads of a PCB and melted to join the electrical components.

3- put the board in the oven and heat it. Solder paste in a syringe. If there is too much paste then a component can swim or float on the solder during the reflow process.

2- position components on the board. Wave soldering on the other hand is generally preferred for attaching multi-leaded through-hole components to circuit boards that are designed for surface-mount components. Reflow soldering is the most popular and widely used method of connecting surface mount technology SMT components to a printed circuit board PCB.